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Product description
SOLDER WIRE, LEAD FREE, 1.0MM, 500G
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Specifications
Supplier product description
SOLDER WIRE, LEAD FREE, 1.0MM, 500G; Flux Type:No Clean and Rosin Flux; Solder Alloy:97.1, 2.6, 0.3 Sn, Ag, Cu; External Diameter - Metric:1mm; External Diameter - Imperial:0.039"; Melting Temperature:217┬░C; Weight - Met
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Supplier parameters
Product code
812025
Brand
MULTICOMP
Supplier's product code
1015472
Product ID
U-587106
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